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Peking University team reports optical link that speeds lab AI tests over 100-fold
An all-optical interconnect developed at Peking University links standard electronic chips and raises AI distributed inference speeds by more than 100 times while cutting resource use to one-ninth. The work was published July 13 in National Science Review.
Jul 13, 2:00 AM·1m read1 source
South China Morning PostAudio version
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Peking University researchers have developed an all-optical interconnect system that links standard electronic chips, raising AI distributed inference speeds by more than 100 times while reducing computational resource use to one-ninth of typical levels, South China Morning Post reported.
The system uses field-programmable gate array chips as modular building blocks. Custom-designed joints connect the chips, including a silicon photonic transceiver chip that operates at 400 gigabits per second and converts electrical signals to optical signals and back.
Corresponding authors Shu Haowen and Wang Xingjun led the project. The study appeared in the journal National Science Review.
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