UK and Japan agree £18bn investment deal covering infrastructure and semiconductors

Officials from the UK and Japan announced a multi-billion-pound investment agreement covering infrastructure, financial services, and offshore wind. The package totals £18 billion and is projected to support tens of thousands of jobs. A Downing Street statement said the deal includes more than £9 billion in infrastructure and financial services plus up to £9 billion in offshore wind.

The same statement described the agreement as unlocking significant inward investment.

Technology partnership The Department for Science, Innovation and Technology announced a formal technology partnership connecting UK microchip design expertise with Japanese advanced manufacturing. The collaboration involves the UK Semiconductor Centre and Rapidus, a Japanese 2nm semiconductor facility backed by £11.6 billion in Japanese government investment.

Officials said the agreement creates a direct pathway for UK semiconductor firms to manufacture advanced chips and marks a step toward greater supply-chain resilience.

Defence and security talks The leaders also discussed defence cooperation, including the Global Combat Air Programme fighter jet initiative. A Downing Street spokesperson said the two sides reviewed conflicts in the Middle East, Russia’s actions in Ukraine, Indo-Pacific stability, and global supply-chain security.

Technology minister Kanishka Narayan said the partnership will give UK innovators in quantum computing, next-generation chips, and clean energy access to investment and manufacturing capacity.