LG Innotek Sets 1 Trillion Won Package Solutions Profit Target for 2031

LG Innotek Co. aims to expand its package solutions business to generate 1 trillion won (US$660 million) in operating profit by 2031, the company said Wednesday. "Leveraging our differentiated technological capabilities, we will rapidly expand our market share in the emerging semiconductor substrate market and foster the package solutions business into a business generating 1 trillion won (US$660 million) in operating profit by 2031," Cho Ji-tae, executive vice president and head of LG Innotek's package solution business unit, told reporters.

72 trillion won in 2025. 9 billion won. LG Innotek also unveiled three semiconductor substrate products on Wednesday that it said offer both strong profitability and growth potential.

One of the products is FC-BGA (Flip Chip Ball Grid Array), a high-performance semiconductor package substrate designed for large-scale computing systems. FC-BGA substrates connect chips to printed circuit boards and are widely used in AI accelerators, central processing units (CPUs) and graphics processing units (GPUs). 55 billion by 2032.

"We will continue to develop FC-BGA substrates that can be applied across a wide range of fields, including edge computing and defense, while actively pursuing new customers among global big tech companies to make the FC-BGA business one of the company's core growth drivers," Cho said. Cho spoke to reporters at LG Innotek's headquarters in Seoul on June 16, 2026.