Samsung Electronics Begins Shipping HBM4E Chip Samples

Samsung Electronics Co. said Friday it has begun shipping samples of its 12-layer HBM4E high-bandwidth memory chip. The company said the move follows its February start of mass production for sixth-generation HBM4 chips. It described the HBM4E as the first next-generation artificial intelligence memory product to reach sample shipment.

Samsung said the chip supports data transfer speeds of up to 16 gigabits per second per pin, more than 20 percent faster than the previous HBM4 lineup. 6 terabytes per second per stack. The company said these specifications enable faster processing for large language models and next-generation AI systems.

Hwang Sang-joon, head of memory development at Samsung Electronics, said in a press release that the company completed the shipment of HBM4E samples without disruption after the successful mass production of HBM4. Samsung said it plans to begin mass production of the HBM4E in line with customer schedules. , Nvidia, and Google among its customers.