technology
Huawei Plans 1.4-Nanometer Chips by 2031 Using New Technology
Huawei said it will begin producing 1.4-nanometer chips by 2031 with its LogicFolding architecture. The company aims to narrow the gap with Taiwan Semiconductor Manufacturing Co., which plans the same process in 2028.
May 25, 8:09 AM·1m read1 source
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Huawei Technologies Co. 4-nanometer chips by 2031 using its own LogicFolding technology. Semiconductor chief He Tingbo made the statement Monday during a chip conference in China. The company said the approach will allow it to advance without access to extreme ultraviolet lithography machines from Dutch supplier ASML Holding NV.
He Tingbo stated that Kirin mobile chips scheduled for release this fall will be the first to use the new architecture.
LogicFolding increases transistor count and data transmission speed on chips. He Tingbo said the method is based on Huawei’s Tau Scaling Law, which the company has used to design 381 chips over the past six years. Huawei also said it is naming the principle “Her’s Law” after its semiconductor chief. The Star 50 Index in Shanghai rose to a record after the announcement.
Shares of Semiconductor Manufacturing International
Corp. rose more than 18 percent. Shares of Hua Hong Semiconductor Ltd. rose the daily limit of 20 percent. Kitty Fok, managing director of research firm IDC China, said the Tau Scaling Law may provide a new reference point for China’s semiconductor industry.
